FINAL CALL FOR PAPERS
LA-CCI 2014 * Latin American Congress on Computational Intelligence
Co-located at ARGENCON 2014
June 11-13, 2014
San Carlos de Bariloche (Argentina)
Organized by the LA-CCI Steering Committee: http://la-cci.org/steering-committee/
AIMS AND SCOPE
The 1st Latin American Congress on Computational Intelligence 2014, co-located with ARGENCON 2014 aims to bring together the Soft Computing community to present the latest achievements and innovations in the multiple areas of Computational Intelligence, encourage participation by young researchers and following the LA-CCI Manifesto: to provide a high-level international forum for scientists, researchers, engineers, professionals and educators to disseminate their latest research results and exchange views of the future research directions in the area of Computational Intelligence.
Any topic related to Computational Intelligence, mainly but not limited to the item listed here.
Presentation of the papers:
-The Scientific committee will select the best 12 papers for oral presentation in LA-CCI track. The official language is English. Other relevant works will be selected as poster presentation.
-Papers may be submitted using the Easychair system by accessing the following address
https://www.easychair.org/conferences/?conf=argencon2014 (notice that an Easychair account is needed for submission)
-General format of follows IEEE (instructions are at http://argencon.ieee.org.ar/llamado/trabajos/)
-LaTeX and MSWord templates can be downloaded from:
Best paper accepted and presented on LA-CCI can be published on a Special Issue of the
“Revista da Sociedade Brasileira de Inteligência Computacional: Learning & Non-Linear Systems”
- Submission of draft papers (23:59, GMT -3)
10 April 201420 April 2014
- Notification of Acceptance
05 May 201410 May 2014
- Submission of camera-ready papers,
20 May 201425 May 2014
- Conference desk opens 12 June 2014
Author of presented papers will be invited to include their papers in Post-Conference Proceedings to be published by IEEE Press.